Inventor
DI CIOCCIO LEA
FR24 patents
⚠️ This page may combine multiple inventors who share the name “DI CIOCCIO LEA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
12 patentsUS6225190B1May 1, 2001
Process for the separation of at least two elements of a structure in contact with one another by ion implantation
COMMISSARIAT ENERGIE ATOMIQUE104 citations98
US6391799B1May 21, 2002
Process for fabricating a structure of semiconductor-on-insulator type in particular SiCOI
COMMISSARIAT ENERGIE ATOMIQUE82 citations97
US7960248B2Jun 14, 2011
Method for transfer of a thin layer
COMMISSARIAT ENERGIE ATOMIQUE8 citations84
US9586207B2Mar 7, 2017
Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
COMMISSARIAT ENERGIE ATOMIQUE3 citations67
US9064783B2Jun 23, 2015
Method for the direct bonding of a silicon oxide layer
COMMISSARIAT ENERGIE ATOMIQUE5 citations67
US7482184B2Jan 27, 2009
Manufacture of a layer of optical interconnection on an electronic circuit
COMMISSARIAT ENERGIE ATOMIQUE5 citations63
US11121117B2Sep 14, 2021
Method for self-assembling microelectronic components
COMMISSARIAT ENERGIE ATOMIQUE1 citations62
US7476595B2Jan 13, 2009
Method for the molecular bonding of microelectronic components to a polymer film
COMMISSARIAT ENERGIE ATOMIQUE2 citations62
US11305372B2Apr 19, 2022
Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials
COMMISSARIAT ENERGIE ATOMIQUE1 citations58
US9318527B2Apr 19, 2016
Method for producing photosensitive infrared detectors
COMMISSARIAT ENERGIE ATOMIQUE2 citations58
US8039370B2Oct 18, 2011
Method of transferring a layer onto a liquid material
COMMISSARIAT ENERGIE ATOMIQUE4 citations56
US7981238B2Jul 19, 2011
Method for relaxing a stressed thin film
COMMISSARIAT ENERGIE ATOMIQUE0 citations31
DI CIOCCIO LEA
4 patentsUS9027821B2May 12, 2015
Process for direct bonding two elements comprising copper portions and portions of dielectric materials
DI CIOCCIO LEA15 citations81
US8647983B2Feb 11, 2014
Simplified copper-copper bonding
DI CIOCCIO LEA12 citations81
US9620412B2Apr 11, 2017
Method for modifying the crystalline structure of a copper element
DI CIOCCIO LEA1 citations49
US8642391B2Feb 4, 2014
Self-assembly of chips on a substrate
DI CIOCCIO LEA0 citations44
ST MICROELECTRONICS SA
2 patentsUS9431373B2Aug 30, 2016
Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
ST MICROELECTRONICS SA0 citations47
US8916393B2Dec 23, 2014
Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure
ST MICROELECTRONICS SA0 citations47