Inventor
LEE CHIU-WEN
TW10 patents
Patents
10 patentsUS11127650B2Sep 21, 2021
Semiconductor device package including thermal dissipation element and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG8 citations83
US6788092B2Sep 7, 2004
Test assembly for integrated circuit package
ADVANCED SEMICONDUCTOR ENG18 citations78
US11594518B2Feb 28, 2023
Semiconductor package
ADVANCED SEMICONDUCTOR ENG2 citations71
US9443813B1Sep 13, 2016
Semiconductor device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations70
US9953930B1Apr 24, 2018
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG5 citations68
US12107074B2Oct 1, 2024
Semiconductor package including processing element and I/O element
ADVANCED SEMICONDUCTOR ENG0 citations61
US11967559B2Apr 23, 2024
Electronic package
ADVANCED SEMICONDUCTOR ENG0 citations61
US12532408B2Jan 20, 2026
Electronic device and package structure
ADVANCED SEMICONDUCTOR ENG0 citations54
US9960136B2May 1, 2018
Semiconductor device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US12517299B2Jan 6, 2026
Optoelectronic device and method of transmitting optical signal
ADVANCED SEMICONDUCTOR ENG0 citations46