Inventor
CHEN MIN-YAO
CN13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN MIN-YAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
7 patentsUS11239184B2Feb 1, 2022
Package substrate, electronic device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations71
US11342272B2May 24, 2022
Substrate structures, and methods for forming the same and semiconductor package structures
ADVANCED SEMICONDUCTOR ENG4 citations70
US12315828B2May 27, 2025
Package substrate, electronic device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US11997798B2May 28, 2024
Package substrate and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US11432406B2Aug 30, 2022
Package substrate
ADVANCED SEMICONDUCTOR ENG0 citations61
US12494437B2Dec 9, 2025
Substrate structure including different size of electronic component
ADVANCED SEMICONDUCTOR ENG0 citations59
US11335650B2May 17, 2022
Package substrate, electronic device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
AALTOSEMI INC
5 patentsUS12599003B2Apr 7, 2026
Manufacturing method of package substrate
AALTOSEMI INC0 citations55
US12550765B2Feb 10, 2026
Package substrate and fabricating method thereof
AALTOSEMI INC0 citations48
US12557664B2Feb 17, 2026
Electronic package and fabricating method thereof
AALTOSEMI INC0 citations45
US12550796B2Feb 10, 2026
Electronic package and fabricating method thereof
AALTOSEMI INC0 citations45
US12550767B2Feb 10, 2026
Package substrate and fabricating method thereof
AALTOSEMI INC0 citations44