Inventor
TOPA ROBERT D
US9 patents
Patents
9 patentsUS5237743AAug 24, 1993
Method of forming a conductive end portion on a flexible circuit member
IBM69 citations94
US5135155AAug 4, 1992
Thermocompression bonding in integrated circuit packaging
IBM34 citations92
US5006917AApr 9, 1991
Thermocompression bonding in integrated circuit packaging
IBM25 citations92
US6626196B2Sep 30, 2003
Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing
IBM23 citations91
US6228246B1May 8, 2001
Removal of metal skin from a copper-Invar-copper laminate
IBM7 citations73
US5242569ASep 7, 1993
Thermocompression bonding in integrated circuit packaging
IBM12 citations73
US4564426AJan 14, 1986
Process for the deposition of palladium-nickel alloy
IBM9 citations73
US5148261ASep 15, 1992
Thermocompression bonding in integrated circuit packaging
IBM5 citations62
US5120418AJun 9, 1992
Lead frame plating apparatus for thermocompression bonding
IBM3 citations62