Inventor

SEKIYA KAZUMA

JP161 patents

⚠️ This page may combine multiple inventors who share the name “SEKIYA KAZUMA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEKIYA KAZUMA

DISCO CORP

Semiconductor wafer dividing method

Method of dicing workpiece

Laser beam processing machine

Method for dividing semiconductor wafer

Processing method and grinding apparatus of wafer

Precision cutting apparatus and cutting method using the same

Cutting machine

Precision cutting apparatus and cutting method using the same

Small unmanned air vehicle repulsing apparatus

Wafer treating method

Semiconductor wafer and processing method for same

Wafer processing method

Water jet-processing machine

Processing method for semiconductor wafer

Grinding wheel

Machining apparatus capable of saving different fluids in machining

Cutting machine for plate-shaped material

Water jet-processing machine

Cutting machine

Cutting apparatus equipped with a blade aligning means

Grinding apparatus and method of driving grinding apparatus

Method of processing wafer

Cutting blade mounting mechanism

Automated workpiece conveying vehicle

Conveyance system

Tape attaching method and tape attaching apparatus

Chuck table correction method and cutting apparatus

Conveyance system

Method of using laminated dressing board

Dressing board, cutting blade dressing method, and cutting apparatus

Processing apparatus and processing method for workpiece

Wafer processing method

Human transporting drone

Wafer processing method

Wafer processing method

Wafer processing system

Electric vehicle and equipment therefor

Chip arranging method

Workpiece cutting method using dummy wafer to determine condition of cutting blade

Optical device processing method

Method of effecting a precision saw-toothed grinding on the surface of a given workpiece

Cutting machine

Cutting-and-transferring system and pellet transferring apparatus

Apparatus for and method of processing workpiece

Processing method of wafer, protective sheet, and protective sheet laying method

Wafer manufacturing method

Method of manufacturing wafer and method of manufacturing stacked device chip

Package substrate processing method

Wafer, wafer manufacturing method, device chip manufacturing method, and resistivity markings

SEKIYA KAZUMA

Optical device wafer processing method and laser processing apparatus