Inventor

HU DYI-CHUNG

TW120 patents

⚠️ This page may combine multiple inventors who share the name “HU DYI-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HU DYI-CHUNG

HU DYI-CHUNG

Package substrate with lateral communication circuitry

High density film for IC package

System in package

Molding compound supported RDL for IC package

Thin film RDL for nanochip package

Packaging substrate having embedded through-via interposer and method of fabricating the same

Chip packaging structure

Packaging substrate having embedded interposer and fabrication method thereof

Spacer connector

Coaxial copper pillar

Bonding film for signal communication between central chip and peripheral chips and fabricating method thereof

Package substrate with double sided fine line RDL

Redistribution film for IC package

Reflective sensing module having light chip and sensor chip mounted to bottom surface of transparent top cover, and wristband comprising said reflective sensing module

Molding compound wrapped package substrate

Stacked package-on-package memory devices

Package substrate

Molding compound supported RDL for IC package

Interposed substrate and manufacturing method thereof

HU DYI CHUNG

Package substrate and package structure

Package substrate with embedded noise shielding walls

Package structure having embedded bonding film and manufacturing method thereof

Package on package configuration

Semiconductor substrate structure and manufacturing method thereof

Integrated substrate and manufacturing method thereof

Package substrate and package structure

Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer

Pad structure and manufacturing method thereof

Redistribution film for IC package

System in package

Embedded optical fiber module

UNIMICRON TECHNOLOGY CORP

Packaging carrier and manufacturing method thereof and chip package structure

Packaging substrate having embedded through-via interposer

Method of fabricating a through-holed interposer

Method of fabricating packaging substrate having embedded through-via interposer

Manufacturing method of interconnection structure

PRIME VIEW HK LIMITED

Redundant scheme for LCD display with integrated data driving circuit

System for protection of drive circuits formed on a substrate of a liquid crystal display

Apparatus for increasing the effective yield of displays with integregated row select driver circuit

IND TECH RES INST

Composite bump bonding

Nondestructive testing apparatus and method

Package substrate having photo-sensitive dielectric layer and method of fabricating the same

HU YU-SHAN

Fabrication method of packaging substrate having through-holed interposer embedded therein

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

ADVANCED CHIP ENG TECH INC

Method for circuits inspection and method of the same

System-in-package and manufacturing method of the same

PRIME VIEW INTERNATIONAL CO

Method of making accurate dimension alignment film for LCD

LCD having trench formed on the substrate(s) to stop sealing material flowing to display areas

HANNSTAR DISPLAY CORP

Back-channel-etch process for forming TFT matrix of LCD with reduced masking steps

TSENG TZYY-JANG

Package structure, fabricating method thereof, and package-on-package device thereby