Inventor
EIMORI TAKAHISA
JP37 patents
⚠️ This page may combine multiple inventors who share the name “EIMORI TAKAHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
33 patentsUS5834817ANov 10, 1998
Field effect transistor with a shaped gate electrode
MITSUBISHI ELECTRIC CORP42 citations96
US5272100ADec 21, 1993
Field effect transistor with T-shaped gate electrode and manufacturing method therefor
MITSUBISHI ELECTRIC CORP61 citations96
US5245208ASep 14, 1993
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP66 citations96
US5051948ASep 24, 1991
Content addressable memory device
MITSUBISHI ELECTRIC CORP81 citations96
US4994893AFeb 19, 1991
Field effect transistor substantially coplanar surface structure
MITSUBISHI ELECTRIC CORP62 citations96
US5654573AAug 5, 1997
Semiconductor device having SOI structure and manufacturing method therefor
MITSUBISHI ELECTRIC CORP53 citations95
US6740584B2May 25, 2004
Semiconductor device and method of fabricating the same
MITSUBISHI ELECTRIC CORP21 citations92
US5930614AJul 27, 1999
Method for forming MOS device having field shield isolation
MITSUBISHI ELECTRIC CORP22 citations92
US5850090ADec 15, 1998
Dynamic semiconductor memory device on SOI substrate
MITSUBISHI ELECTRIC CORP26 citations92
US5691551ANov 25, 1997
Semiconductor memory device
MITSUBISHI ELECTRIC CORP28 citations92
US5650342AJul 22, 1997
Method of making a field effect transistor with a T shaped polysilicon gate electrode
MITSUBISHI ELECTRIC CORP18 citations92
US5637899AJun 10, 1997
Semiconductor device
MITSUBISHI ELECTRIC CORP49 citations92
US5521419AMay 28, 1996
Semiconductor device having field shield element isolating structure and method of manufacturing the same
MITSUBISHI ELECTRIC CORP36 citations92
US5442212AAug 15, 1995
Semiconductor memory device
MITSUBISHI ELECTRIC CORP34 citations92
US5225704AJul 6, 1993
Field shield isolation structure for semiconductor memory device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP37 citations92
US5177571AJan 5, 1993
Ldd mosfet with particularly shaped gate electrode immune to hot electron effect
MITSUBISHI ELECTRIC CORP37 citations92
US5164803ANov 17, 1992
Cmos semiconductor device with an element isolating field shield
MITSUBISHI ELECTRIC CORP36 citations92
US5089863AFeb 18, 1992
Field effect transistor with T-shaped gate electrode
MITSUBISHI ELECTRIC CORP33 citations92
US5471080ANov 28, 1995
Field effect transistor with a shaped gate electrode
MITSUBISHI ELECTRIC CORP19 citations82
US5094965AMar 10, 1992
Field effect transistor having substantially coplanar surface structure and a manufacturing method therefor
MITSUBISHI ELECTRIC CORP21 citations82
US5067000ANov 19, 1991
Semiconductor device having field shield isolation
MITSUBISHI ELECTRIC CORP17 citations82
US6268278B1Jul 31, 2001
Semiconductor device and manufacturing process thereof
MITSUBISHI ELECTRIC CORP7 citations74
US6087710AJul 11, 2000
Semiconductor device having self-aligned contacts
MITSUBISHI ELECTRIC CORP5 citations74
US5610418AMar 11, 1997
Semiconductor memory device
MITSUBISHI ELECTRIC CORP16 citations74
US5543646AAug 6, 1996
Field effect transistor with a shaped gate electrode
MITSUBISHI ELECTRIC CORP11 citations74
US5459344AOct 17, 1995
Stacked capacitor type semiconductor memory device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP12 citations74
US5278437AJan 11, 1994
Stacked capacitor type semiconductor memory device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP7 citations74
US5181094AJan 19, 1993
Complementary semiconductor device having improved device isolating region
MITSUBISHI ELECTRIC CORP9 citations74
US5180683AJan 19, 1993
Method of manufacturing stacked capacitor type semiconductor memory device
MITSUBISHI ELECTRIC CORP9 citations74
US5097310AMar 17, 1992
Complementary semiconductor device having improved device isolating region
MITSUBISHI ELECTRIC CORP10 citations74
US5721444AFeb 24, 1998
Thin-film transistor having a buried impurity region and method of fabricating the same
MITSUBISHI ELECTRIC CORP10 citations73
US6495928B1Dec 17, 2002
Transfer mark structure for multi-layer interconnecting and method for the manufacture thereof
MITSUBISHI ELECTRIC CORP6 citations62
US6573171B2Jun 3, 2003
Semiconductor device and manufacturing process thereof
MITSUBISHI ELECTRIC CORP0 citations52