Inventor
CASEY JON ALFRED
US15 patents
⚠️ This page may combine multiple inventors who share the name “CASEY JON ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US5763093AJun 9, 1998
Aluminum nitride body having graded metallurgy
IBM10 citations71
US5682589AOct 28, 1997
Aluminum nitride body having graded metallurgy
IBM9 citations71
US5759669AJun 2, 1998
Apparatus and method for screening green sheet with via hole using porous backing material
IBM14 citations69
US5655209AAug 5, 1997
Multilayer ceramic substrates having internal capacitor, and process for producing same
IBM12 citations69
US7875502B2Jan 25, 2011
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
IBM5 citations62
US11569181B2Jan 31, 2023
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
IBM0 citations61
US10892233B2Jan 12, 2021
Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers
IBM0 citations61
US5891543AApr 6, 1999
Apparatus and method for screening using electrostatic adhesion
IBM3 citations58
US12504747B2Dec 23, 2025
Multicomponent module design and fabrication
IBM0 citations56
US7732932B2Jun 8, 2010
Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners
IBM1 citations52
US7579069B2Aug 25, 2009
Negative coefficient of thermal expansion particles and method of forming the same
IBM1 citations51
US11031343B2Jun 8, 2021
Fins for enhanced die communication
IBM0 citations48