Inventor
CHA GI-HO
KR7 patents
⚠️ This page may combine multiple inventors who share the name “CHA GI-HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS5783022AJul 21, 1998
Apparatus and methods for wafer debonding using a liquid jet
SAMSUNG ELECTRONICS CO LTD110 citations96
US5863375AJan 26, 1999
Apparatus and methods for wafer debonding using a liquid jet
SAMSUNG ELECTRONICS CO LTD37 citations91
US5665631ASep 9, 1997
SOI substrate manufacturing method
SAMSUNG ELECTRONICS CO LTD31 citations89
US6045892AApr 4, 2000
Metal wiring structures for integrated circuits including seed layer
SAMSUNG ELECTRONICS CO LTD10 citations73
US5746883AMay 5, 1998
Apparatus for bonding semiconductor wafers
SAMSUNG ELECTRONICS CO LTD4 citations59
FAIRCHILD KR SEMICONDUCTOR LTD
2 patentsUS6878605B2Apr 12, 2005
Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate
FAIRCHILD KR SEMICONDUCTOR LTD16 citations89
US7582935B2Sep 1, 2009
Methods for manufacturing SOI substrate using wafer bonding and complementary high voltage bipolar transistor using the SOI substrate
FAIRCHILD KR SEMICONDUCTOR LTD8 citations80