Inventor

KAWASHIMO HIROSHI

JP4 patents

Patents

4 patents

US6020625AFeb 1, 2000

Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame

MITSUBISHI ELECTRIC CORP143 citations93

US5207786AMay 4, 1993

Wire bonding method

MITSUBISHI ELECTRIC CORP7 citations69

US4824801AApr 25, 1989

Method of manufacturing aluminum bonding pad with PSG coating

MITSUBISHI ELECTRIC CORP2 citations58

US6530512B2Mar 11, 2003

Wire bonding apparatus and wire bonding method

MITSUBISHI ELECTRIC CORP0 citations37