Inventor
LIN HSI-CHIEN
TW23 patents
⚠️ This page may combine multiple inventors who share the name “LIN HSI-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TPK TOUCH SOLUTIONS INC
12 patentsUS9647041B2May 9, 2017
Organic light emitting diode (OLED) touch display device
TPK TOUCH SOLUTIONS INC5 citations72
US10490609B2Nov 26, 2019
Organic light emitting diode (OLED) touch display device
TPK TOUCH SOLUTIONS INC0 citations51
US10203750B2Feb 12, 2019
Touch panel and a manufacturing method thereof
TPK TOUCH SOLUTIONS INC0 citations51
US9978304B2May 22, 2018
Organic light emitting diode (OLED) touch display device
TPK TOUCH SOLUTIONS INC1 citations51
US9952693B2Apr 24, 2018
Touch panel
TPK TOUCH SOLUTIONS INC0 citations51
US9760164B2Sep 12, 2017
Touch panel and a manufacturing method thereof
TPK TOUCH SOLUTIONS INC0 citations51
US9543365B2Jan 10, 2017
Touch panel
TPK TOUCH SOLUTIONS INC0 citations51
US9983713B2May 29, 2018
Touch display and method for manufacturing the same
TPK TOUCH SOLUTIONS INC0 citations49
US9535524B2Jan 3, 2017
Touch display comprising a polarizer with integrated nano-silver touch electrodes and method for manufacturing the same
TPK TOUCH SOLUTIONS INC1 citations49
US9640590B2May 2, 2017
Organic light-emitting diode display and fabrication method thereof
TPK TOUCH SOLUTIONS INC0 citations47
US10037095B2Jul 31, 2018
Methods of forming nanostructure conductive films and touch devices including the nanostructure conductive films
TPK TOUCH SOLUTIONS INC0 citations42
US10854850B2Dec 1, 2020
Organic light-emitting diode display device
TPK TOUCH SOLUTIONS INC0 citations41
XINTEC INC
4 patentsUS8748926B2Jun 10, 2014
Chip package with multiple spacers and method for forming the same
XINTEC INC4 citations70
US9799778B2Oct 24, 2017
Chip package having a trench exposed protruding conductive pad
XINTEC INC3 citations67
US9196589B2Nov 24, 2015
Stacked wafer structure and method for stacking a wafer
XINTEC INC0 citations45
US9859320B2Jan 2, 2018
Chip package and manufacturing method thereof
XINTEC INC0 citations42