Inventor
HSIEH HAN-KUN
TW6 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH HAN-KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICON INTEGRATED SYS CORP
4 patentsUS6790758B2Sep 14, 2004
Method for fabricating conductive bumps and substrate with metal bumps for flip chip packaging
SILICON INTEGRATED SYS CORP12 citations72
US6864586B2Mar 8, 2005
Padless high density circuit board
SILICON INTEGRATED SYS CORP4 citations61
US6720246B1Apr 13, 2004
Flip chip assembly process for forming an underfill encapsulant
SILICON INTEGRATED SYS CORP3 citations61
US6707677B1Mar 16, 2004
Chip-packaging substrate and test method therefor
SILICON INTEGRATED SYS CORP3 citations61
PHOENIX PREC TECHNOLOGY CORP
2 patentsUS7098126B2Aug 29, 2006
Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints
PHOENIX PREC TECHNOLOGY CORP16 citations80
US6574863B2Jun 10, 2003
Thin core substrate for fabricating a build-up circuit board
PHOENIX PREC TECHNOLOGY CORP10 citations72