Inventor
SUEOKA KUNIAKI
JP37 patents
⚠️ This page may combine multiple inventors who share the name “SUEOKA KUNIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
31 patentsUS6396469B1May 28, 2002
Method of displaying an image on liquid crystal display and a liquid crystal display
IBM183 citations99
US4873599AOct 10, 1989
Magnetic head assembly for perpendicular magnetic recording
IBM65 citations96
US6952036B2Oct 4, 2005
Thin-film transistor structure, method for manufacturing the thin-film transistor structure, and display device using the thin-film transistor structure
IBM29 citations92
US5266897ANov 30, 1993
Magnetic field observation with tunneling microscopy
IBM39 citations91
US6844957B2Jan 18, 2005
Three level stacked reflective display
IBM44 citations90
US7396494B1Jul 8, 2008
Oriented graphite film, methods of manufacture thereof and articles comprising the same
IBM9 citations84
US7510762B1Mar 31, 2009
Oriented graphite film, methods of manufacture thereof and articles comprising the same
IBM7 citations74
US11574848B2Feb 7, 2023
Underfill injection for electronic devices
IBM2 citations73
US10615143B2Apr 7, 2020
Injection molded solder bumping
IBM3 citations73
US10037967B1Jul 31, 2018
Injection molded solder bumping
IBM2 citations73
US7514290B1Apr 7, 2009
Chip-to-wafer integration technology for three-dimensional chip stacking
IBM3 citations63
US11637325B2Apr 25, 2023
Large capacity solid state battery
IBM0 citations62
US11320419B2May 3, 2022
Sampling of breath gas
IBM0 citations62
US11211638B2Dec 28, 2021
Large capacity solid state battery
IBM1 citations62
US11069917B2Jul 20, 2021
Stacked film battery architecture
IBM0 citations62
US11063288B2Jul 13, 2021
Stacked film battery architecture
IBM0 citations62
US10388578B2Aug 20, 2019
Wafer scale testing and initialization of small die chips
IBM1 citations62
US10325839B2Jun 18, 2019
Reduction of stress in via structure
IBM1 citations62
US10903526B2Jan 26, 2021
Electron device stack structure
IBM0 citations61
US12532670B2Jan 20, 2026
Vertical transmon structure and its fabrication process
IBM0 citations52
US11316143B2Apr 26, 2022
Stacked device structure
IBM0 citations52
US10679912B2Jun 9, 2020
Wafer scale testing and initialization of small die chips
IBM0 citations52
US10672638B2Jun 2, 2020
Picking up irregular semiconductor chips
IBM0 citations52
US10431847B2Oct 1, 2019
Stacked film battery architecture
IBM0 citations52
US10424510B2Sep 24, 2019
Solder fill into high aspect through holes
IBM0 citations52
US10388566B2Aug 20, 2019
Solder fill into high aspect through holes
IBM0 citations52
US9466533B2Oct 11, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM1 citations52
US9373545B2Jun 21, 2016
Semiconductor structure including a through electrode, and method for forming the same
IBM0 citations52
US7326600B2Feb 5, 2008
Method for manufacturing a thin-film transistor structure
IBM0 citations52
US10679916B2Jun 9, 2020
Circuit module and manufacturing method thereof
IBM0 citations51
US10074583B2Sep 11, 2018
Circuit module and manufacturing method thereof
IBM1 citations51
NAKAGAWA SHIGERU
2 patentsUS8542963B2Sep 24, 2013
Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system
NAKAGAWA SHIGERU12 citations82
US8442362B2May 14, 2013
Method for manufacturing optical coupling element, optical transmission substrate, optical coupling component, coupling method, and optical interconnect system
NAKAGAWA SHIGERU3 citations61