Inventor
TSAI CHEN JUNG
TW24 patents
⚠️ This page may combine multiple inventors who share the name “TSAI CHEN JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MACRONIX INT CO LTD
16 patentsUS6650008B2Nov 18, 2003
Stacked semiconductor packaging device
MACRONIX INT CO LTD54 citations95
US7521783B2Apr 21, 2009
Ultra thin image sensor package structure and method for fabrication
MACRONIX INT CO LTD21 citations92
US7227253B2Jun 5, 2007
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD16 citations92
US7217995B2May 15, 2007
Apparatus for stacking electrical components using insulated and interconnecting via
MACRONIX INT CO LTD20 citations92
US7045888B2May 16, 2006
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD16 citations92
US6972372B1Dec 6, 2005
Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
MACRONIX INT CO LTD23 citations92
US6559526B2May 6, 2003
Multiple-step inner lead of leadframe
MACRONIX INT CO LTD52 citations92
US7122904B2Oct 17, 2006
Semiconductor packaging device and manufacture thereof
MACRONIX INT CO LTD16 citations83
US7495327B2Feb 24, 2009
Chip stacking structure
MACRONIX INT CO LTD5 citations73
US7462925B2Dec 9, 2008
Method and apparatus for stacking electrical components using via to provide interconnection
MACRONIX INT CO LTD6 citations73
US7102159B2Sep 5, 2006
Ultra thin image sensor package structure and method for fabrication
MACRONIX INT CO LTD8 citations73
US7259042B2Aug 21, 2007
Ultra thin dual chip image sensor package structure and method for fabrication
MACRONIX INT CO LTD4 citations62
US6977436B2Dec 20, 2005
Semiconductor packaging device
MACRONIX INT CO LTD4 citations62
US7892888B2Feb 22, 2011
Method and apparatus for stacking electrical components using via to provide interconnection
MACRONIX INT CO LTD0 citations52
US7291927B2Nov 6, 2007
Dual chips stacked packaging structure
MACRONIX INT CO LTD1 citations52
US7755188B2Jul 13, 2010
Method and apparatus for stacking electrical components using via to provide interconnection
MACRONIX INT CO LTD0 citations51
HK APPLIED SCIENCE & TECH RES
3 patentsUS8044899B2Oct 25, 2011
Methods and apparatus for backlight calibration
HK APPLIED SCIENCE & TECH RES76 citations95
US7841739B2Nov 30, 2010
Total internal reflection side emitting coupling device
HK APPLIED SCIENCE & TECH RES8 citations84
US7828472B2Nov 9, 2010
Light guiding strip and backlight module and display using the same
HK APPLIED SCIENCE & TECH RES13 citations82