Inventor
OH YOONG
KR13 patents
⚠️ This page may combine multiple inventors who share the name “OH YOONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
11 patentsUS9736939B2Aug 15, 2017
Printed circuit board and method of manufacturing printed circuit board
SAMSUNG ELECTRO MECH3 citations72
US9736927B2Aug 15, 2017
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations72
US10991647B2Apr 27, 2021
Printed circuit board and package structure having the same
SAMSUNG ELECTRO MECH2 citations70
US10849225B1Nov 24, 2020
Printed circuit board
SAMSUNG ELECTRO MECH3 citations70
US12224235B2Feb 11, 2025
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US11297714B2Apr 5, 2022
Printed circuit board
SAMSUNG ELECTRO MECH0 citations60
US7622329B2Nov 24, 2009
Method for fabricating core substrate using paste bumps
SAMSUNG ELECTRO MECH2 citations60
US7169707B2Jan 30, 2007
Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
SAMSUNG ELECTRO MECH6 citations59
US11088089B2Aug 10, 2021
Package substrate
SAMSUNG ELECTRO MECH0 citations50
US7859106B2Dec 28, 2010
Multilayer printed circuit board using paste bumps
SAMSUNG ELECTRO MECH0 citations50
US7973248B2Jul 5, 2011
Printed circuit board using paste bump and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations38