Inventor

GOWDA ARUN VIRUPAKSHA

US62 patents

⚠️ This page may combine multiple inventors who share the name “GOWDA ARUN VIRUPAKSHA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOWDA ARUN VIRUPAKSHA

GEN ELECTRIC

Sensor package and method

Electronics package having a self-aligning interconnect assembly and method of making same

Embedded semiconductor device package and method of manufacturing thereof

Power overlay structure and method of making same

Thermal transport structure and associated method

Double side cooled power module with power overlay

Power overlay structure and method of making same

Power overlay structure and method of making same

Electronics package with embedded through-connect structure and method of manufacturing thereof

Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof

Power overlay structure and method of making same

Embedded semiconductor device package and method of manufacturing thereof

Thermal management system and associated method

Sealed wafer packaging of microelectromechanical systems

Three-dimensional stacked integrated circuit devices and methods of assembling the same

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Power overlay structure having wirebonds and method of manufacturing same

Power electronics package and method of manufacturing thereof

Stacked electronics package and method of manufacturing thereof

Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

Reliable surface mount integrated power module

Power overlay structure with leadframe connections

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Switch structure and associated circuit

System and a method for controlling flow of solder

Power electronics package and method of manufacturing thereof

Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

Stacked electronics package and method of manufacturing thereof

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Electronics package having a self-aligning interconnect assembly and method of making same

Power overlay structure and reconstituted semiconductor wafer having wirebonds

Electrical interconnect structure for an embedded electronics package

Electrical interconnect structure for an embedded electronics package

Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof

Integrated circuit package and method of making same

Electrical interconnect for an integrated circuit package and method of making same

GOWDA ARUN VIRUPAKSHA

Power overlay structure with leadframe connections

Direct write interconnections and method of manufacturing thereof

Diffusion barrier for surface mount modules

Overlay circuit structure for interconnecting light emitting semiconductors

Press-pack module with power overlay interconnection

MCCONNELEE PAUL ALAN

Method for fabricating a semiconductor device package

Semiconductor device package

Integrated circuit package and method of making same

BEAUPRE RICHARD ALFRED

Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance

Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof

DELGADO ELADIO CLEMENTE

Coaxial power module

CHAUHAN SHAKTI SINGH

Reliable surface mount integrated power module

GE AVIATION SYSTEMS LLC

Semiconductor device package and method of forming