Inventor

MCCONNELEE PAUL ALAN

US58 patents

⚠️ This page may combine multiple inventors who share the name “MCCONNELEE PAUL ALAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCCONNELEE PAUL ALAN

GEN ELECTRIC

Power electronic module packaging

System and method for stacked die embedded chip build-up

Organic light emitting device and method for mounting

Power electronic module packaging

Multilayer capacitors using amorphous hydrogenated carbon

Embedded semiconductor device package and method of manufacturing thereof

Power overlay structure and method of making same

Power overlay structure and method of making same

Power overlay structure and method of making same

Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof

Electronics package with embedded through-connect structure and method of manufacturing thereof

Power overlay structure and method of making same

Embedded semiconductor device package and method of manufacturing thereof

Power semiconductor module and fabrication method

Apparatus and method for reducing pitch in an integrated circuit

Structure and method for molding optical disks

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Power overlay structure having wirebonds and method of manufacturing same

Power electronics package and method of manufacturing thereof

Reliable surface mount integrated power module

Power overlay structure with leadframe connections

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Electrical interconnect for an integrated circuit package and method of making same

Methods for selective deposition of graded materials on continuously fed objects

Electronic chip package with reduced contact pad pitch

Power electronics package and method of manufacturing thereof

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Power overlay structure and reconstituted semiconductor wafer having wirebonds

Electrical interconnect structure for an embedded electronics package

Electrical interconnect for an integrated circuit package and method of making same

Electrical interconnect structure for an embedded electronics package

Electrical interconnect for an integrated circuit package and method of making same

Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof

Integrated circuit package and method of making same

Electrical interconnect for an integrated circuit package and method of making same

MCCONNELEE PAUL ALAN

Method for fabricating a semiconductor device package

Semiconductor device package

Electrical interconnect for an integrated circuit package and method of making same

Ultrathin buried die module and method of manufacturing thereof

Method of chip package build-up

Integrated circuit package and method of making same

GOWDA ARUN VIRUPAKSHA

Power overlay structure with leadframe connections

Diffusion barrier for surface mount modules

BEAUPRE RICHARD ALFRED

Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance

Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof

DELGADO ELADIO CLEMENTE

Power semiconductor module and fabrication method

CHAUHAN SHAKTI SINGH

Reliable surface mount integrated power module

KIM TAE WON

High integrity protective coatings

GORCZYCA THOMAS BERT

Epoxy encapsulating and lamination adhesive and method of making same

LOCKHEED CORP

Fabrication of plastic module with exposed backside contact