Inventor
OLGADO DONALD J K
US29 patents
⚠️ This page may combine multiple inventors who share the name “OLGADO DONALD J K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
23 patentsUS6440261B1Aug 27, 2002
Dual buffer chamber cluster tool for semiconductor wafer processing
APPLIED MATERIALS INC482 citations99
US7427338B2Sep 23, 2008
Flow diffuser to be used in electro-chemical plating system
APPLIED MATERIALS INC21 citations92
US7285036B2Oct 23, 2007
Pad assembly for electrochemical mechanical polishing
APPLIED MATERIALS INC18 citations92
US7029365B2Apr 18, 2006
Pad assembly for electrochemical mechanical processing
APPLIED MATERIALS INC29 citations92
US6837978B1Jan 4, 2005
Deposition uniformity control for electroplating apparatus, and associated method
APPLIED MATERIALS INC36 citations92
US6736408B2May 18, 2004
Rotary vacuum-chuck with venturi formed at base of rotating shaft
APPLIED MATERIALS INC33 citations92
US6662673B1Dec 16, 2003
Linear motion apparatus and associated method
APPLIED MATERIALS INC45 citations92
US6585876B2Jul 1, 2003
Flow diffuser to be used in electro-chemical plating system and method
APPLIED MATERIALS INC35 citations92
US7138014B2Nov 21, 2006
Electroless deposition apparatus
APPLIED MATERIALS INC37 citations91
US7655565B2Feb 2, 2010
Electroprocessing profile control
APPLIED MATERIALS INC8 citations84
US7137868B2Nov 21, 2006
Pad assembly for electrochemical mechanical processing
APPLIED MATERIALS INC12 citations84
US7114693B1Oct 3, 2006
Stable cell platform
APPLIED MATERIALS INC17 citations84
US7101253B2Sep 5, 2006
Load cup for chemical mechanical polishing
APPLIED MATERIALS INC14 citations84
US6720263B2Apr 13, 2004
Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection
APPLIED MATERIALS INC17 citations84
US6557237B1May 6, 2003
Removable modular cell for electro-chemical plating and method
APPLIED MATERIALS INC17 citations84
US7297047B2Nov 20, 2007
Bubble suppressing flow controller with ultrasonic flow meter
APPLIED MATERIALS INC10 citations83
US6770565B2Aug 3, 2004
System for planarizing metal conductive layers
APPLIED MATERIALS INC13 citations83
US7963826B2Jun 21, 2011
Apparatus and methods for conditioning a polishing pad
APPLIED MATERIALS INC9 citations81
US6689418B2Feb 10, 2004
Apparatus for wafer rinse and clean and edge etching
APPLIED MATERIALS INC9 citations73
US7988535B2Aug 2, 2011
Platen exhaust for chemical mechanical polishing system
APPLIED MATERIALS INC4 citations63
US6802947B2Oct 12, 2004
Apparatus and method for electro chemical plating using backside electrical contacts
APPLIED MATERIALS INC6 citations63
US7709382B2May 4, 2010
Electroprocessing profile control
APPLIED MATERIALS INC2 citations62
US7678245B2Mar 16, 2010
Method and apparatus for electrochemical mechanical processing
APPLIED MATERIALS INC0 citations52