Inventor
HUANG LIN-CHIH
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HUANG LIN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS9748190B2Aug 29, 2017
Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations93
US10290604B2May 14, 2019
Substrateless integrated circuit packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9842825B2Dec 12, 2017
Substrateless integrated circuit packages and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9831177B2Nov 28, 2017
Through via structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11756883B2Sep 12, 2023
Through via structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728296B2Aug 15, 2023
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9679859B2Jun 13, 2017
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10714423B2Jul 14, 2020
Through via structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10217687B2Feb 26, 2019
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9953920B2Apr 24, 2018
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9929069B2Mar 27, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9564345B1Feb 7, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10811374B2Oct 20, 2020
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10157866B2Dec 18, 2018
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51