Inventor

PEDRON JR SERAFIN P

US6 patents

⚠️ This page may combine multiple inventors who share the name “PEDRON JR SERAFIN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UTAC HONG KONG LTD

2 patents

US9305889B2Apr 5, 2016

Leadless integrated circuit package having standoff contacts and die attach pad

UTAC HONG KONG LTD3 citations69

US8828801B2Sep 9, 2014

Leadless array plastic package with various IC packaging configurations

UTAC HONG KONG LTD2 citations58

ASAT LTD

1 patent

US6818980B1Nov 16, 2004

Stacked semiconductor package and method of manufacturing the same

ASAT LTD113 citations95

OLIN CORP

1 patent

US5877551AMar 2, 1999

Semiconductor package having a ground or power ring and a metal substrate

OLIN CORP23 citations87

POWELL KIRK

1 patent

US8736037B2May 27, 2014

Leadless integrated circuit package having standoff contacts and die attach pad

POWELL KIRK8 citations76

MCMILLAN JOHN

1 patent

US8486762B2Jul 16, 2013

Leadless array plastic package with various IC packaging configurations

MCMILLAN JOHN0 citations42