Inventor

WAKAYAMA YOJI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “WAKAYAMA YOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LINTEC CORP

2 patents

US9296925B2Mar 29, 2016

Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device

LINTEC CORP3 citations71

US8735881B1May 27, 2014

Resin film forming sheet for chip, and method for manufacturing semiconductor chip

LINTEC CORP2 citations59

WAKAYAMA YOJI

1 patent

US8114520B2Feb 14, 2012

Laser dicing sheet and process for producing chip body

WAKAYAMA YOJI3 citations55

SHINODA TOMONORI

1 patent

US8674349B2Mar 18, 2014

Resin film forming sheet for chip, and method for manufacturing semiconductor chip

SHINODA TOMONORI3 citations54

SATO YOSUKE

1 patent

US8174130B2May 8, 2012

Laser dicing sheet and manufacturing method for chip body

SATO YOSUKE0 citations49

OHASHI HITOSHI

1 patent

US9878520B2Jan 30, 2018

Adhesive sheet

OHASHI HITOSHI0 citations36