P

Inventor

WANG ANCHUAN

US144 patents
⚠️ This page may combine multiple inventors who share the name “WANG ANCHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

46 patents
US9991134B2Jun 5, 2018

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC100 citations99
US9842744B2Dec 12, 2017

Methods for etch of SiN films

APPLIED MATERIALS INC113 citations99
US9837284B2Dec 5, 2017

Oxide etch selectivity enhancement

APPLIED MATERIALS INC112 citations99
US9704723B2Jul 11, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC114 citations99
US9659792B2May 23, 2017

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC125 citations99
US9613822B2Apr 4, 2017

Oxide etch selectivity enhancement

APPLIED MATERIALS INC128 citations99
US9607856B2Mar 28, 2017

Selective titanium nitride removal

APPLIED MATERIALS INC126 citations99
US9520303B2Dec 13, 2016

Aluminum selective etch

APPLIED MATERIALS INC131 citations99
US9478434B2Oct 25, 2016

Chlorine-based hardmask removal

APPLIED MATERIALS INC134 citations99
US9478432B2Oct 25, 2016

Silicon oxide selective removal

APPLIED MATERIALS INC129 citations99
US9449845B2Sep 20, 2016

Selective titanium nitride etching

APPLIED MATERIALS INC138 citations99
US9449850B2Sep 20, 2016

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC135 citations99
US9437451B2Sep 6, 2016

Radical-component oxide etch

APPLIED MATERIALS INC134 citations99
US9418858B2Aug 16, 2016

Selective etch of silicon by way of metastable hydrogen termination

APPLIED MATERIALS INC138 citations99
US9412608B2Aug 9, 2016

Dry-etch for selective tungsten removal

APPLIED MATERIALS INC134 citations99
US9384997B2Jul 5, 2016

Dry-etch selectivity

APPLIED MATERIALS INC146 citations99
US9378969B2Jun 28, 2016

Low temperature gas-phase carbon removal

APPLIED MATERIALS INC529 citations99
US9368364B2Jun 14, 2016

Silicon etch process with tunable selectivity to SiO2 and other materials

APPLIED MATERIALS INC146 citations99
US9355863B2May 31, 2016

Non-local plasma oxide etch

APPLIED MATERIALS INC130 citations99
US9349605B1May 24, 2016

Oxide etch selectivity systems and methods

APPLIED MATERIALS INC156 citations99
US9343327B2May 17, 2016

Methods for etch of sin films

APPLIED MATERIALS INC147 citations99
US9309598B2Apr 12, 2016

Oxide and metal removal

APPLIED MATERIALS INC560 citations99
US9299583B1Mar 29, 2016

Aluminum oxide selective etch

APPLIED MATERIALS INC160 citations99
US9299575B2Mar 29, 2016

Gas-phase tungsten etch

APPLIED MATERIALS INC163 citations99
US9287134B2Mar 15, 2016

Titanium oxide etch

APPLIED MATERIALS INC153 citations99
US9275834B1Mar 1, 2016

Selective titanium nitride etch

APPLIED MATERIALS INC554 citations99
US9263278B2Feb 16, 2016

Dopant etch selectivity control

APPLIED MATERIALS INC150 citations99
US9236265B2Jan 12, 2016

Silicon germanium processing

APPLIED MATERIALS INC169 citations99
US9236266B2Jan 12, 2016

Dry-etch for silicon-and-carbon-containing films

APPLIED MATERIALS INC153 citations99
US9209012B2Dec 8, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC173 citations99
US9190293B2Nov 17, 2015

Even tungsten etch for high aspect ratio trenches

APPLIED MATERIALS INC251 citations99
US9184055B2Nov 10, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC181 citations99
US9153442B2Oct 6, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC220 citations99
US9111877B2Aug 18, 2015

Non-local plasma oxide etch

APPLIED MATERIALS INC182 citations99
US9093371B2Jul 28, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC184 citations99
US9093390B2Jul 28, 2015

Conformal oxide dry etch

APPLIED MATERIALS INC185 citations99
US9040422B2May 26, 2015

Selective titanium nitride removal

APPLIED MATERIALS INC194 citations99
US9023734B2May 5, 2015

Radical-component oxide etch

APPLIED MATERIALS INC182 citations99
US9023732B2May 5, 2015

Processing systems and methods for halide scavenging

APPLIED MATERIALS INC187 citations99
US8980763B2Mar 17, 2015

Dry-etch for selective tungsten removal

APPLIED MATERIALS INC206 citations99
US8969212B2Mar 3, 2015

Dry-etch selectivity

APPLIED MATERIALS INC184 citations99
US8956980B1Feb 17, 2015

Selective etch of silicon nitride

APPLIED MATERIALS INC226 citations99
US8951429B1Feb 10, 2015

Tungsten oxide processing

APPLIED MATERIALS INC221 citations99
US8921234B2Dec 30, 2014

Selective titanium nitride etching

APPLIED MATERIALS INC187 citations99
US8801952B1Aug 12, 2014

Conformal oxide dry etch

APPLIED MATERIALS INC191 citations99
US8765574B2Jul 1, 2014

Dry etch process

APPLIED MATERIALS INC182 citations99

ZHANG JINGCHUN

4 patents

Showing the top 50 of 144 patents by PatentIndex Score.