Inventor
CHOU LEI-CHUN
TW23 patents
Patents
23 patentsUS10700207B2Jun 30, 2020
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
TAIWAN SEMICONDUCTOR MFG CO LTD46 citations97
US11532751B2Dec 20, 2022
Metal rail conductors for non-planar semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US11289384B2Mar 29, 2022
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10804402B2Oct 13, 2020
Metal rail conductors for non-planar semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10763365B2Sep 1, 2020
Metal rail conductors for non-planar semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US11495687B2Nov 8, 2022
Metal rail conductors for non-planar semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11018157B2May 25, 2021
Local interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10950456B2Mar 16, 2021
High-density semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10032759B2Jul 24, 2018
High-density semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12034076B2Jul 9, 2024
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11121256B2Sep 14, 2021
Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12113132B2Oct 8, 2024
Metal rail conductors for non-planar semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10879120B2Dec 29, 2020
Self aligned via and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12272603B2Apr 8, 2025
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080588B2Sep 3, 2024
Buried metal for FinFET device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11916077B2Feb 27, 2024
Method for routing local interconnect structure at same level as reference metal line
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848242B2Dec 19, 2023
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11810811B2Nov 7, 2023
Buried metal for FinFET device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11532482B2Dec 20, 2022
High-density semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11424154B2Aug 23, 2022
Buried metal for FinFET device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867833B2Dec 15, 2020
Buried metal for FinFET device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10861750B2Dec 8, 2020
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10446406B2Oct 15, 2019
High-density semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52