Inventor

LEE TECK SIM

MY32 patents

⚠️ This page may combine multiple inventors who share the name “LEE TECK SIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE TECK SIM

INFINEON TECHNOLOGIES AG

Package for electronic device

Leadframe having mold lock vent

Semiconductor package with mold lock vent

Package with electrically insulated carrier and at least one step on encapsulant

Semiconductor package for multiphase circuitry device

Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package

Package with electrically insulated carrier and at least one step on encapsulant

Linear spacer for spacing a carrier of a package

Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package

Method of electrically isolating shared leads of a lead frame strip

Electronic device and method for fabricating an electronic device

Transistor package with three-terminal clip

Semiconductor device

Multi-chip package

Semiconductor package with heat slug and rivet free die attach area

INFINEON TECHNOLOGIES AUSTRIA AG

Functionalized interface structure

Semiconductor chip package having a repeating footprint pattern

Semiconductor devices with improved thermal and electrical performance

Semiconductor package with expanded heat spreader

Package and lead frame design for enhanced creepage and clearance

Semiconductor chip package comprising side wall marking

Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip

Semiconductor component having inner and outer semiconductor component housings

SMD package with top side cooling

Power semiconductor device

Semiconductor chip package having contact pins at short side edges

INFINEON TECHNOLOGIES AUSTRIA

High power electronic component with multiple leadframes

Semiconductor device package

Packaged device comprising non-integer lead pitches and method of manufacturing the same

GOLLER BERND

Method of fabricating a semiconductor package with mold lock opening

CHONG CHOOI MEI

Multi-chip semiconductor packages and assembly thereof

LEE TECK SIM

Semiconductor device with protruding component portion and method of packaging