Inventor
TEAN KE YAN
MY9 patents
⚠️ This page may combine multiple inventors who share the name “TEAN KE YAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS11876028B2Jan 16, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG2 citations71
US11652078B2May 16, 2023
High voltage semiconductor package with pin fit leads
INFINEON TECHNOLOGIES AG3 citations67
US11621204B2Apr 4, 2023
Molded semiconductor module having a mold step for increasing creepage distance
INFINEON TECHNOLOGIES AG3 citations64
US12094793B2Sep 17, 2024
Package with electrically insulated carrier and at least one step on encapsulant
INFINEON TECHNOLOGIES AG0 citations61
US11069600B2Jul 20, 2021
Semiconductor package with space efficient lead and die pad design
INFINEON TECHNOLOGIES AG1 citations59
US11211353B2Dec 28, 2021
Clips for semiconductor packages
INFINEON TECHNOLOGIES AG0 citations54
US12057376B2Aug 6, 2024
Three level interconnect clip
INFINEON TECHNOLOGIES AG0 citations48
INFINEON TECHNOLOGIES AUSTRIA AG
2 patentsUS11600547B2Mar 7, 2023
Semiconductor package with expanded heat spreader
INFINEON TECHNOLOGIES AUSTRIA AG3 citations68
US11804424B2Oct 31, 2023
Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip
INFINEON TECHNOLOGIES AUSTRIA AG0 citations47