P

Inventor

KAWASE TATSUYA

JP34 patents
⚠️ This page may combine multiple inventors who share the name “KAWASE TATSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

24 patents
USD785577SMay 2, 2017

Semiconductor device

MITSUBISHI ELECTRIC CORP36 citations98
USD754084SApr 19, 2016

Semiconductor device

MITSUBISHI ELECTRIC CORP41 citations98
USD719537SDec 16, 2014

Semiconductor device

MITSUBISHI ELECTRIC CORP39 citations98
USD805485SDec 19, 2017

Semiconductor device

MITSUBISHI ELECTRIC CORP31 citations94
USD769834SOct 25, 2016

Semiconductor device

MITSUBISHI ELECTRIC CORP16 citations92
USD903611SDec 1, 2020

Semiconductor device

MITSUBISHI ELECTRIC CORP20 citations89
US10388589B2Aug 20, 2019

Semiconductor device, inverter device, and vehicle

MITSUBISHI ELECTRIC CORP11 citations84
US9716052B2Jul 25, 2017

Semiconductor device comprising a conductive film joining a diode and switching element

MITSUBISHI ELECTRIC CORP7 citations83
US12208975B2Jan 28, 2025

Transport system, and transport module

MITSUBISHI ELECTRIC CORP2 citations75
US11239123B2Feb 1, 2022

Semiconductor module, semiconductor device, and vehicle

MITSUBISHI ELECTRIC CORP2 citations73
US9530766B2Dec 27, 2016

Semiconductor device

MITSUBISHI ELECTRIC CORP3 citations72
US12362694B2Jul 15, 2025

Conveyance system

MITSUBISHI ELECTRIC CORP1 citations64
US6646915B2Nov 11, 2003

Semiconductor device

MITSUBISHI ELECTRIC CORP4 citations63
US12500135B2Dec 16, 2025

Semiconductor device comprising semiconductor element; insulating component; lead electrode; and first bonding material, second bonding material, third bonding material, and fourth bonding material made of a same material

MITSUBISHI ELECTRIC CORP0 citations62
US12463574B2Nov 4, 2025

Transfer system

MITSUBISHI ELECTRIC CORP0 citations62
US11996355B2May 28, 2024

Semiconductor device and method for manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP0 citations62
US11450592B2Sep 20, 2022

Semiconductor package with a plurality of chips having a groove in the encapsulation

MITSUBISHI ELECTRIC CORP0 citations60
US12509305B2Dec 30, 2025

Transport system

MITSUBISHI ELECTRIC CORP0 citations52
US12316255B1May 27, 2025

Conveyance system

MITSUBISHI ELECTRIC CORP0 citations52
US9362219B2Jun 7, 2016

Semiconductor module and semiconductor device

MITSUBISHI ELECTRIC CORP1 citations52
US10770376B2Sep 8, 2020

Semiconductor device, inverter unit and automobile

MITSUBISHI ELECTRIC CORP0 citations51
US12575445B2Mar 10, 2026

Semiconductor apparatus and method for manufacturing semiconductor apparatus

MITSUBISHI ELECTRIC CORP0 citations45
US10825751B2Nov 3, 2020

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations41
US10504820B2Dec 10, 2019

Semiconductor module and electric power conversion device

MITSUBISHI ELECTRIC CORP0 citations41

KAWASE TATSUYA

3 patents

TERUMO CLINICAL SUPPLY CO LTD

2 patents

ASTELLAS PHARMA INC

2 patents

FUTAMI TAKASHI

1 patent

NISHI HIROFUMI

1 patent

YAHOO JAPAN CORP

1 patent