Inventor
IMOTO YUJI
JP26 patents
⚠️ This page may combine multiple inventors who share the name “IMOTO YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
25 patentsUSD715747SOct 21, 2014
Cooling jacket
MITSUBISHI ELECTRIC CORP21 citations92
US10388589B2Aug 20, 2019
Semiconductor device, inverter device, and vehicle
MITSUBISHI ELECTRIC CORP11 citations84
US10104775B2Oct 16, 2018
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP9 citations82
US9888617B2Feb 6, 2018
Semiconductor device having multiple power modules and cooling mechanism for the power modules
MITSUBISHI ELECTRIC CORP9 citations82
US9064846B2Jun 23, 2015
Semiconductor device
MITSUBISHI ELECTRIC CORP9 citations81
US11239123B2Feb 1, 2022
Semiconductor module, semiconductor device, and vehicle
MITSUBISHI ELECTRIC CORP2 citations73
US10211122B2Feb 19, 2019
Semiconductor module including a case and base board
MITSUBISHI ELECTRIC CORP4 citations73
US10978366B2Apr 13, 2021
Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module
MITSUBISHI ELECTRIC CORP3 citations72
US10658324B2May 19, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP2 citations72
US9917064B2Mar 13, 2018
Semiconductor device with a plate-shaped lead terminal
MITSUBISHI ELECTRIC CORP3 citations72
US11996355B2May 28, 2024
Semiconductor device and method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations62
US11257768B2Feb 22, 2022
Semiconductor device and power conversion device
MITSUBISHI ELECTRIC CORP0 citations62
US11101225B2Aug 24, 2021
Semiconductor device and power conversion device
MITSUBISHI ELECTRIC CORP1 citations62
US10727163B2Jul 28, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP1 citations62
US9455215B2Sep 27, 2016
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP2 citations62
US11450592B2Sep 20, 2022
Semiconductor package with a plurality of chips having a groove in the encapsulation
MITSUBISHI ELECTRIC CORP0 citations60
US11145616B2Oct 12, 2021
Semiconductor device, power conversion apparatus, and method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP0 citations60
US10770376B2Sep 8, 2020
Semiconductor device, inverter unit and automobile
MITSUBISHI ELECTRIC CORP0 citations51
US10707141B2Jul 7, 2020
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP0 citations51
US9698091B2Jul 4, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP1 citations51
US9691730B2Jun 27, 2017
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations51
US12131969B2Oct 29, 2024
Semiconductor module
MITSUBISHI ELECTRIC CORP0 citations47
US10504820B2Dec 10, 2019
Semiconductor module and electric power conversion device
MITSUBISHI ELECTRIC CORP0 citations41
US10068819B2Sep 4, 2018
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations41
US10204886B2Feb 12, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations40