Inventor
MIN BOK GYU
KR13 patents
⚠️ This page may combine multiple inventors who share the name “MIN BOK GYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
8 patentsUS10312196B2Jun 4, 2019
Semiconductor packages including indicators for evaluating a distance and methods of calculating the distance
SK HYNIX INC3 citations70
US12033952B2Jul 9, 2024
Semiconductor packages including at least one die position checker
SK HYNIX INC0 citations61
US11764160B2Sep 19, 2023
Semiconductor packages including at least one die position checker
SK HYNIX INC0 citations61
US11239177B2Feb 1, 2022
Semiconductor packages including die over-shift indicating patterns
SK HYNIX INC0 citations59
US12581961B2Mar 17, 2026
Substrate having a die position mark and a semiconductor die stack structure including semiconductor dies stacked on the substrate
SK HYNIX INC0 citations51
US11769700B2Sep 26, 2023
Semiconductor substrate, semiconductor package including semiconductor substrate, and test method of semiconductor substrate
SK HYNIX INC0 citations49
US10692816B2Jun 23, 2020
Semiconductor packages including die over-shift indicating patterns
SK HYNIX INC0 citations49
US9412716B2Aug 9, 2016
Semiconductor package and method for manufacturing the same
SK HYNIX INC0 citations39
MIN BOK GYU
3 patentsUS8624375B2Jan 7, 2014
Semiconductor package for selecting semiconductor chip from a chip stack
MIN BOK GYU2 citations56
US8525319B2Sep 3, 2013
Selecting chips within a stacked semiconductor package using through-electrodes
MIN BOK GYU2 citations55
US8242582B2Aug 14, 2012
Semiconductor package and stacked semiconductor package having the same
MIN BOK GYU0 citations46