Inventor

KO YEONGBEOM

KR18 patents

⚠️ This page may combine multiple inventors who share the name “KO YEONGBEOM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KO YEONGBEOM

MICRON TECHNOLOGY INC

Face-to-face semiconductor device with fan-out porch

Ground connection for semiconductor device assembly

Face-to-face semiconductor device with fan-out porch

Face-to-face semiconductor device with fan-out porch

Stacked semiconductor dies for semiconductor device assemblies

Stacked semiconductor dies for semiconductor device assemblies

Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems

SAMSUNG ELECTRONICS CO LTD

Wafer structure and semiconductor device

Semiconductor package including non-conductive film and method for forming the same

Semiconductor package including non-conductive film and method for forming the same

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor packages and methods of forming the same

KO WONJUN

Integrated circuit packaging system with dielectric support and method of manufacture thereof

LEE HUNTEAK

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

YANG DAEWOOK

Integrated circuit packaging system with an encapsulation and method of manufacture thereof

LEE HUN TEAK

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof