Inventor
BINDRA PERMINDER S
US16 patents
⚠️ This page may combine multiple inventors who share the name “BINDRA PERMINDER S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5435057AJul 25, 1995
Interconnection method and structure for organic circuit boards
IBM290 citations97
US5229550AJul 20, 1993
Encapsulated circuitized power core alignment and lamination
IBM170 citations97
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US5129142AJul 14, 1992
Encapsulated circuitized power core alignment and lamination
IBM135 citations96
US5298685AMar 29, 1994
Interconnection method and structure for organic circuit boards
IBM79 citations95
US4479852AOct 30, 1984
Method for determination of concentration of organic additive in plating bath
IBM51 citations91
US5048178ASep 17, 1991
Alignment--registration tool for fabricating multi-layer electronic packages
IBM48 citations87
US4490219ADec 25, 1984
Method of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrate
IBM26 citations82
US4397730AAug 9, 1983
Electrolytic cells with alkaline electrolytes containing trifluoromethylane sulfonic acid
IBM20 citations82
US4457986AJul 3, 1984
Use of underpotential deposited layers of metals on foreign metal substrates as catalysts for electrolytic cells
IBM24 citations81
US4540473ASep 10, 1985
Copper plating bath having increased plating rate, and method
IBM10 citations68
US4910049AMar 20, 1990
Conditioning a dielectric substrate for plating thereon
IBM4 citations61