Inventor
CHO STEVE
US28 patents
⚠️ This page may combine multiple inventors who share the name “CHO STEVE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CNA INT INC
16 patentsUSD813607SMar 27, 2018
Soup mug
CNA INT INC48 citations97
US9801488B2Oct 31, 2017
Steamer container system
CNA INT INC26 citations93
USD772002SNov 22, 2016
Steamer container lid
CNA INT INC32 citations93
USD770832SNov 8, 2016
Coffee maker
CNA INT INC26 citations93
USD765463SSep 6, 2016
Blender base
CNA INT INC30 citations93
USD771432SNov 15, 2016
Steamer container lid
CNA INT INC23 citations92
USD770831SNov 8, 2016
Coffee maker
CNA INT INC23 citations92
USD812974SMar 20, 2018
Steamer plate
CNA INT INC7 citations84
USD804235SDec 5, 2017
Steamer basket
CNA INT INC15 citations84
USD772640SNov 29, 2016
Steamer basket
CNA INT INC8 citations83
USD771998SNov 22, 2016
Steamer basket
CNA INT INC6 citations83
USD771997SNov 22, 2016
Steamer basket
CNA INT INC12 citations83
USD771431SNov 15, 2016
Steamer container lid
CNA INT INC15 citations83
USD770841SNov 8, 2016
Oven
CNA INT INC8 citations83
USD765464SSep 6, 2016
Blender base
CNA INT INC9 citations83
USD770842SNov 8, 2016
Oven
CNA INT INC3 citations72
INTEL CORP
9 patentsUS11373972B2Jun 28, 2022
Microelectronic structures including bridges
INTEL CORP9 citations85
US10431537B1Oct 1, 2019
Electromigration resistant and profile consistent contact arrays
INTEL CORP11 citations83
US11309239B2Apr 19, 2022
Electromigration resistant and profile consistent contact arrays
INTEL CORP2 citations72
US11488918B2Nov 1, 2022
Surface finishes with low rBTV for fine and mixed bump pitch architectures
INTEL CORP3 citations70
US11735558B2Aug 22, 2023
Microelectronic structures including bridges
INTEL CORP0 citations62
US12341117B2Jun 24, 2025
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates
INTEL CORP0 citations60
US11935857B2Mar 19, 2024
Surface finishes with low RBTV for fine and mixed bump pitch architectures
INTEL CORP1 citations60
US12334422B2Jun 17, 2025
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates
INTEL CORP0 citations55
US10854541B2Dec 1, 2020
Electromigration resistant and profile consistent contact arrays
INTEL CORP0 citations51