Inventor

TERASAKI NOBUYUKI

JP53 patents

⚠️ This page may combine multiple inventors who share the name “TERASAKI NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TERASAKI NOBUYUKI

MITSUBISHI MATERIALS CORP

Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Power module substrate, power module substrate with heat sink, and power module

Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method

Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate

Bonded body and insulated circuit board

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

Copper-ceramic bonded body and insulation circuit substrate

Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Process for producing bonded body and process for producing power module substrate

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Method for manufacturing bonded body and method for manufacturing power-module substrate

Bonded body and power module substrate

Copper-ceramic bonded body and power module substrate

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate

Method of producing bonded body and method of producing power module substrate

Method for manufacturing power module substrate

Substrate for power modules, substrate with heat sink for power modules, and power module

Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module

Bonded body, power module substrate, power module and method for producing bonded body

Bonded body and power module substrate

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion module

Copper/ceramic assembly, insulating circuit substrate, production method for copper/ceramic assembly, and production method for insulating circuit substrate

Insulated circuit board

Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit board

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

Copper/ceramic joined body and insulating circuit substrate

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method

Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board

Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

Bonded body and insulating circuit substrate

Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate

Bonded body, insulated circuit board with heat sink, and heat sink

Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit substrate with heat sink, power module, LED module, and thermoelectric module

Ceramic/aluminum bonded body, insulating substrate, LED module, ceramic member, method for producing ceramic/aluminum bonded body, and method for producing insulating substrate

Bonded body, insulated circuit board with heat sink, and heat sink

Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Bonding structure of aluminum member and copper member

Bonding body, power module substrate, and heat-sink-attached power module substrate

Bonded body and power module substrate

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

KUROMITSU YOSHIROU

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

NAGATOMO YOSHIYUKI

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module