Inventor
SAWAI HIDEKAZU
JP5 patents
Patents
5 patentsUS5897800AApr 27, 1999
Laser beam machine based on optically scanning system
MITSUBISHI ELECTRIC CORP20 citations89
US5585015ADec 17, 1996
Laser machining apparatus and method
MITSUBISHI ELECTRIC CORP20 citations89
US6420676B2Jul 16, 2002
Method for machining wiring board with laser beam and device for same
MITSUBISHI ELECTRIC CORP6 citations72
US6750425B2Jun 15, 2004
Three-dimensional laser beam machine
MITSUBISHI ELECTRIC CORP7 citations66
US6201213B1Mar 13, 2001
Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering
MITSUBISHI ELECTRIC CORP3 citations61