Inventor
KUROSAWA MIKI
JP13 patents
Patents
13 patentsUS5463202AOct 31, 1995
Laser machining apparatus and method
MITSUBISHI ELECTRIC CORP164 citations98
US6875951B2Apr 5, 2005
Laser machining device
MITSUBISHI ELECTRIC CORP135 citations96
US6633376B1Oct 14, 2003
Apparatus for inspecting a printed circuit board
MITSUBISHI ELECTRIC CORP55 citations96
US6353203B1Mar 5, 2002
Laser machining device
MITSUBISHI ELECTRIC CORP137 citations96
US6635849B1Oct 21, 2003
Laser beam machine for micro-hole machining
MITSUBISHI ELECTRIC CORP110 citations95
US6972392B2Dec 6, 2005
Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
MITSUBISHI ELECTRIC CORP18 citations92
US6373026B1Apr 16, 2002
Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
MITSUBISHI ELECTRIC CORP17 citations92
US6107600AAug 22, 2000
Laser machining apparatus
MITSUBISHI ELECTRIC CORP34 citations92
US5933218AAug 3, 1999
Laser beam machining apparatus
MITSUBISHI ELECTRIC CORP39 citations92
US5698120ADec 16, 1997
Laser machining system with control based on machining state recognition
MITSUBISHI ELECTRIC CORP110 citations92
US6420676B2Jul 16, 2002
Method for machining wiring board with laser beam and device for same
MITSUBISHI ELECTRIC CORP6 citations72
US6201213B1Mar 13, 2001
Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering
MITSUBISHI ELECTRIC CORP3 citations61
US6804035B2Oct 12, 2004
Laser machining apparatus
MITSUBISHI ELECTRIC CORP1 citations51