Inventor
TSUCHIYA YASUAKI
JP28 patents
⚠️ This page may combine multiple inventors who share the name “TSUCHIYA YASUAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
12 patentsUS6530968B2Mar 11, 2003
Chemical mechanical polishing slurry
NEC ELECTRONICS CORP109 citations97
US6585568B2Jul 1, 2003
Chemical mechanical polishing slurry
NEC ELECTRONICS CORP54 citations95
US6585786B2Jul 1, 2003
Slurry for chemical mechanical polishing
NEC ELECTRONICS CORP16 citations83
US6723626B2Apr 20, 2004
Method of manufacturing semiconductor device
NEC ELECTRONICS CORP10 citations74
US6783446B1Aug 31, 2004
Chemical mechanical polishing apparatus and method of chemical mechanical polishing
NEC ELECTRONICS CORP6 citations73
US6831014B2Dec 14, 2004
Method of manufacturing a semiconductor apparatus using chemical mechanical polishing
NEC ELECTRONICS CORP6 citations63
US7067427B2Jun 27, 2006
Manufacturing method of semiconductor device
NEC ELECTRONICS CORP5 citations62
US6930037B2Aug 16, 2005
Process for forming a metal interconnect
NEC ELECTRONICS CORP6 citations62
US7229570B2Jun 12, 2007
Slurry for chemical mechanical polishing
NEC ELECTRONICS CORP4 citations61
US7091123B2Aug 15, 2006
Method of forming metal wiring line including using a first insulating film as a stopper film
NEC ELECTRONICS CORP6 citations61
US6951512B2Oct 4, 2005
Chemical mechanical polishing apparatus and method of chemical mechanical polishing
NEC ELECTRONICS CORP1 citations51
US7601640B2Oct 13, 2009
Method of manfacturing semiconductor device
NEC ELECTRONICS CORP0 citations49
NEC CORP
11 patentsUS6225217B1May 1, 2001
Method of manufacturing semiconductor device having multilayer wiring
NEC CORP52 citations96
US6436811B1Aug 20, 2002
Method of forming a copper-containing metal interconnect using a chemical mechanical planarization (CMP) slurry
NEC CORP60 citations95
US6428405B1Aug 6, 2002
Abrasive pad and polishing method
NEC CORP24 citations92
US6443807B1Sep 3, 2002
Polishing process for use in method of fabricating semiconductor device
NEC CORP18 citations84
US6184120B1Feb 6, 2001
Method of forming a buried plug and an interconnection
NEC CORP11 citations74
US6140225AOct 31, 2000
Method of manufacturing semiconductor device having multilayer wiring
NEC CORP15 citations74
US5959359ASep 28, 1999
Semiconductor device with a copper wiring pattern
NEC CORP6 citations74
US6478834B2Nov 12, 2002
Slurry for chemical mechanical polishing
NEC CORP13 citations73
US6368981B1Apr 9, 2002
Method of manufacturing semiconductor device and chemical mechanical polishing apparatus
NEC CORP12 citations73
US6235071B1May 22, 2001
Chemical mechanical polishing method for highly accurate in-plane uniformity in polishing rate over position
NEC CORP14 citations73
US6350186B1Feb 26, 2002
Apparatus and method for chemical mechanical polishing
NEC CORP5 citations63
RENESAS ELECTRONICS CORP
3 patentsUS9779992B2Oct 3, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP2 citations72
US9275935B2Mar 1, 2016
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP4 citations72
US7955980B2Jun 7, 2011
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations49