Inventor

WEBSTER STEVEN

US141 patents

⚠️ This page may combine multiple inventors who share the name “WEBSTER STEVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WEBSTER STEVEN

AMKOR TECHNOLOGY INC

Image sensor package

Method for forming an image sensor package with vision die in lens housing

Optical module with lens integral holder

Optical fiber having tapered end and optical connector with reciprocal opening

Chip size semiconductor packages with stacked dies

Flip chip image sensor package fabrication method

Mounting for a package containing a chip

Micromachine stacked flip chip package fabrication method

Image sensor package having sealed cavity over active area

Snap lid image sensor package

Molded image sensor package having lens holder

Semiconductor chip having a radio-frequency identification transceiver

Flip chip on glass image sensor package fabrication method

Molded window array for image sensor packages

Wafer having alignment marks extending from a first to a second surface of the wafer

Thin image sensor package

Vacuum sealed package for semiconductor chip

Method of assembling a snap lid image sensor package

Wafer scale image sensor package fabrication method

Pre-drilled ball grid array package

Micromirror device package

Bond wire pressure sensor die package

Method for forming a flip chip pressure sensor die package

Wafer scale image sensor package

Wafer level production of chip size semiconductor packages

Method of making and stacking a semiconductor package

Semiconductor package and circuit board for making the package

Camera module fabrication method including singulating a substrate

Optical module with lens integral holder fabrication method

Flip chip on glass sensor package

Micromirror device package fabrication method

Heat spreader with spring IC package

Micromachine stacked wirebonded package

Molded image sensor package

Method of singulation using laser cutting

Method for forming a reduced thickness packaged electronic device

Thin image sensor package fabrication method

Method of fabricating image sensor packages in an array

Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area

Precision marking and singulation method

Active heat sink for cooling a semiconductor chip

Optical module having cavity substrate

Camera module fabrication method including the step of removing a lens mount and window from the mold

Camera module having a threaded lens barrel and a ball grid array connecting device

Image sensor package fabrication method

APPLE INC

Capacitive sensor packaging

Capacitive sensor packaging

Capacitive sensor packaging

Mirror tilt actuation

WEBSTER STEVEN

Digital camera with light splitter