Inventor
KIM CHANG HOON
KR109 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHANG HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
23 patentsUS9439301B2Sep 6, 2016
Multilayered chip electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations84
US9336946B2May 10, 2016
Multilayer ceramic electronic component and assembly board having the same
SAMSUNG ELECTRO MECH8 citations84
US9627134B2Apr 18, 2017
Ceramic dielectric composition and multilayer ceramic capacitor containing the same
SAMSUNG ELECTRO MECH5 citations83
US9859058B2Jan 2, 2018
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH8 citations82
US9984825B2May 29, 2018
Dielectric ceramic composition, dielectric material, and multilayer ceramic capacitor containing the same
SAMSUNG ELECTRO MECH4 citations73
US9818538B2Nov 14, 2017
Multilayer ceramic electronic component and board for mounting thereof
SAMSUNG ELECTRO MECH4 citations73
US9343235B2May 17, 2016
Multilayer ceramic capacitor and assembly board having the same
SAMSUNG ELECTRO MECH5 citations73
US9076596B2Jul 7, 2015
Laminated ceramic electronic component having a cover layer with dielectric grains and method of fabricating the same
SAMSUNG ELECTRO MECH5 citations73
US9824819B2Nov 21, 2017
Dielectric ceramic composition and multilayer ceramic capacitor including the same
SAMSUNG ELECTRO MECH2 citations72
US9779875B2Oct 3, 2017
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH2 citations72
US9583266B2Feb 28, 2017
Dielectric ceramic composition, dielectric material and multilayer ceramic capacitor including the same
SAMSUNG ELECTRO MECH3 citations72
US11031185B2Jun 8, 2021
Electronic component
SAMSUNG ELECTRO MECH3 citations71
US10770233B2Sep 8, 2020
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH2 citations71
US10373762B2Aug 6, 2019
Multilayer ceramic capacitor and board having the same
SAMSUNG ELECTRO MECH3 citations71
US9336952B2May 10, 2016
Multilayer ceramic electronic part and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations71
US9576730B2Feb 21, 2017
Dielectric ceramic composition, dielectric material, and multilayer ceramic capacitor containing the same
SAMSUNG ELECTRO MECH2 citations69
US9514884B2Dec 6, 2016
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH5 citations68
US9424991B2Aug 23, 2016
Dielectric ceramic composition and multilayer ceramic capacitor comprising the same
SAMSUNG ELECTRO MECH2 citations63
US9042080B2May 26, 2015
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations63
US9449759B2Sep 20, 2016
Multilayer ceramic capacitor and board having the same mounted thereon
SAMSUNG ELECTRO MECH2 citations62
US9390856B2Jul 12, 2016
Dielectric composition, multilayer ceramic capacitor using the same, and method for manufacturing multilayer ceramic capacitor
SAMSUNG ELECTRO MECH2 citations62
US9076578B2Jul 7, 2015
Dielectric composition and ceramic electronic component including the same
SAMSUNG ELECTRO MECH2 citations62
US8962506B2Feb 24, 2015
Dielectric composition and multilayer ceramic electronic component including the same
SAMSUNG ELECTRO MECH2 citations60
PARK MYUNG JUN
4 patentsUS8941972B2Jan 27, 2015
Multilayer ceramic electronic component
PARK MYUNG JUN9 citations83
US8941971B2Jan 27, 2015
Multilayer ceramic electronic component and fabrication method thereof
PARK MYUNG JUN4 citations72
US8767375B2Jul 1, 2014
Multilayer ceramic electronic component and method of fabricating the same
PARK MYUNG JUN2 citations61
US8675343B2Mar 18, 2014
Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof
PARK MYUNG JUN2 citations61
SEOUL VIOSYS CO LTD
4 patentsUS10727376B2Jul 28, 2020
Light emitting diode package and method of manufacturing the same
SEOUL VIOSYS CO LTD3 citations73
US10304998B2May 28, 2019
Light emitting diode chip and light emitting device having the same
SEOUL VIOSYS CO LTD6 citations71
US12107195B2Oct 1, 2024
Light emitting diode package and method of manufacturing the same
SEOUL VIOSYS CO LTD0 citations62
US11563152B2Jan 24, 2023
Light emitting diode package and method of manufacturing the same
SEOUL VIOSYS CO LTD0 citations62
SAMSUNG DISPLAY CO LTD
2 patentsJEON BYUNG JUN
2 patentsSAMSUNG ELECTRONICS CO LTD
2 patentsKIM CHANG-HOON
2 patentsLG ELECTRONICS INC
1 patentKOREA ELECTRONICS TELECOMM
1 patentKIM KYUNG HO
1 patentKANG SUNG KOO
1 patentYOON SEOK HYUN
1 patentSAMSUNG AEROSPACE IND
1 patentIN CHI HYUN
1 patentPOLYPENCO KOREA COMPANY LTD
1 patentKIM JOO-HAN
1 patentSAMSUNG SDS CO LTD
1 patentLEE KYU HO
1 patentShowing the top 50 of 109 patents by PatentIndex Score.