Inventor
DOYLE JAMES PATRICK
US21 patents
⚠️ This page may combine multiple inventors who share the name “DOYLE JAMES PATRICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6061114AMay 9, 2000
Alignment of liquid crystal layers
IBM71 citations95
US6020946AFeb 1, 2000
Dry processing for liquid-crystal displays using low energy ion bombardment
IBM83 citations95
US6632483B1Oct 14, 2003
Ion gun deposition and alignment for liquid-crystal applications
IBM71 citations94
US7417315B2Aug 26, 2008
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM12 citations92
US6331381B1Dec 18, 2001
Method for making a liquid crystal alignment layer
IBM32 citations92
US6724449B1Apr 20, 2004
Vertical aligned liquid crystal display and method using dry deposited alignment layer films
IBM31 citations91
US6613602B2Sep 2, 2003
Method and system for forming a thermoelement for a thermoelectric cooler
IBM30 citations89
US6577365B1Jun 10, 2003
Method and apparatus to form liquid crystal alignment layer
IBM13 citations79
US6593586B2Jul 15, 2003
Method and apparatus for making a crystal alignment layer
IBM6 citations73
US6147730ANov 14, 2000
Color filters formed sequentially with intervening protective films for flat panel displays
IBM9 citations73
US6679625B2Jan 20, 2004
Scanning heat flow probe
IBM6 citations72
US7556979B2Jul 7, 2009
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM1 citations63
US6866415B2Mar 15, 2005
Scanning heat flow probe
IBM1 citations61
US6817761B2Nov 16, 2004
Scanning heat flow probe
IBM2 citations61
US6652139B2Nov 25, 2003
Scanning heat flow probe and the method of fabricating the same
IBM3 citations61
US7883919B2Feb 8, 2011
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
IBM0 citations52
US7579069B2Aug 25, 2009
Negative coefficient of thermal expansion particles and method of forming the same
IBM1 citations51