Inventor
CHOI IL-HEUNG
KR8 patents
Patents
8 patentsUS7453159B2Nov 18, 2008
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD14 citations92
US6642627B2Nov 4, 2003
Semiconductor chip having bond pads and multi-chip package
SAMSUNG ELECTRONICS CO LTD14 citations92
US7576440B2Aug 18, 2009
Semiconductor chip having bond pads and multi-chip package
SAMSUNG ELECTRONICS CO LTD9 citations83
US7547977B2Jun 16, 2009
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD4 citations73
US7541682B2Jun 2, 2009
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD5 citations73
US6183589B1Feb 6, 2001
Method for manufacturing lead-on-chip (LOC) semiconductor packages using liquid adhesive applied under the leads
SAMSUNG ELECTRONICS CO LTD7 citations73
US7148578B2Dec 12, 2006
Semiconductor multi-chip package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7825523B2Nov 2, 2010
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD0 citations51