Inventor
KIM JEONG-JIN
KR23 patents
⚠️ This page may combine multiple inventors who share the name “KIM JEONG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS7453159B2Nov 18, 2008
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD14 citations92
US6642627B2Nov 4, 2003
Semiconductor chip having bond pads and multi-chip package
SAMSUNG ELECTRONICS CO LTD14 citations92
US7576440B2Aug 18, 2009
Semiconductor chip having bond pads and multi-chip package
SAMSUNG ELECTRONICS CO LTD9 citations83
US7547977B2Jun 16, 2009
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD4 citations73
US7541682B2Jun 2, 2009
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD5 citations73
US7148578B2Dec 12, 2006
Semiconductor multi-chip package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7825523B2Nov 2, 2010
Semiconductor chip having bond pads
SAMSUNG ELECTRONICS CO LTD0 citations51
US9436077B2Sep 6, 2016
Method of fabricating a pellicle frame
SAMSUNG ELECTRONICS CO LTD0 citations47
SAMSUNG DISPLAY CO LTD
4 patentsUS10553664B2Feb 4, 2020
Display device
SAMSUNG DISPLAY CO LTD6 citations83
US10943971B2Mar 9, 2021
Display device
SAMSUNG DISPLAY CO LTD4 citations72
US12283550B2Apr 22, 2025
Electronic apparatus and method of manufacturing the same
SAMSUNG DISPLAY CO LTD0 citations60
US11756895B2Sep 12, 2023
Electronic apparatus and method of manufacturing the same
SAMSUNG DISPLAY CO LTD0 citations60
KOREA ELECTRONICS TELECOMM
3 patentsUS9136396B2Sep 15, 2015
Semiconductor device and method of manufacturing the same
KOREA ELECTRONICS TELECOMM8 citations83
US8952422B2Feb 10, 2015
Transistor and method of fabricating the same
KOREA ELECTRONICS TELECOMM1 citations52
US9159583B2Oct 13, 2015
Methods of manufacturing nitride semiconductor devices
KOREA ELECTRONICS TELECOMM1 citations50