Inventor
KU SHU-E
TW3 patents
Patents
3 patentsUS6756321B2Jun 29, 2004
Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant
TAIWAN SEMICONDUCTOR MFG49 citations91
US6623654B2Sep 23, 2003
Thin interface layer to improve copper etch stop
TAIWAN SEMICONDUCTOR MFG5 citations72
US6884659B2Apr 26, 2005
Thin interface layer to improve copper etch stop
TAIWAN SEMICONDUCTOR MFG1 citations50