Inventor
SIAH SOH YUN
SG28 patents
⚠️ This page may combine multiple inventors who share the name “SIAH SOH YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES SG PTE LTD
13 patentsUS9905282B1Feb 27, 2018
Top electrode dome formation
GLOBALFOUNDRIES SG PTE LTD15 citations84
US10062641B2Aug 28, 2018
Integrated circuits including a dummy metal feature and methods of forming the same
GLOBALFOUNDRIES SG PTE LTD3 citations73
US10608046B2Mar 31, 2020
Integrated two-terminal device with logic device for embedded application
GLOBALFOUNDRIES SG PTE LTD4 citations72
US10446607B2Oct 15, 2019
Integrated two-terminal device with logic device for embedded application
GLOBALFOUNDRIES SG PTE LTD4 citations72
US11158646B2Oct 26, 2021
Memory device with dielectric blocking layer for improving interpoly dielectric breakdown
GLOBALFOUNDRIES SG PTE LTD0 citations62
US11119917B2Sep 14, 2021
Neuromorphic memories with split gate flash multi-level cell and method of making the same
GLOBALFOUNDRIES SG PTE LTD0 citations62
US10439129B2Oct 8, 2019
Shielded MRAM cell
GLOBALFOUNDRIES SG PTE LTD1 citations62
US9111866B2Aug 18, 2015
Method of forming split-gate cell for non-volative memory devices
GLOBALFOUNDRIES SG PTE LTD3 citations60
US10224338B2Mar 5, 2019
Cost-effective method to form a reliable memory device with selective silicidation and resulting device
GLOBALFOUNDRIES SG PTE LTD0 citations52
US8957523B2Feb 17, 2015
Dielectric posts in metal layers
GLOBALFOUNDRIES SG PTE LTD0 citations52
US9236391B2Jan 12, 2016
Method of forming split-gate cell for non-volative memory devices
GLOBALFOUNDRIES SG PTE LTD0 citations50
US9793208B2Oct 17, 2017
Plasma discharge path
GLOBALFOUNDRIES SG PTE LTD0 citations41
US9929165B1Mar 27, 2018
Method for producing integrated circuit memory cells with less dedicated lithographic steps
GLOBALFOUNDRIES SG PTE LTD0 citations38
CHARTERED SEMICONDUCTOR MFG
12 patentsUS6153485ANov 28, 2000
Salicide formation on narrow poly lines by pulling back of spacer
CHARTERED SEMICONDUCTOR MFG108 citations98
US6025267AFeb 15, 2000
Silicon nitride--TEOS oxide, salicide blocking layer for deep sub-micron devices
CHARTERED SEMICONDUCTOR MFG140 citations98
US6228727B1May 8, 2001
Method to form shallow trench isolations with rounded corners and reduced trench oxide recess
CHARTERED SEMICONDUCTOR MFG142 citations97
US6350661B2Feb 26, 2002
Silicon nitride capped shallow trench isolation method for fabricating sub-micron devices with borderless contacts
CHARTERED SEMICONDUCTOR MFG49 citations95
US6265302B1Jul 24, 2001
Partially recessed shallow trench isolation method for fabricating borderless contacts
CHARTERED SEMICONDUCTOR MFG77 citations95
US6165871ADec 26, 2000
Method of making low-leakage architecture for sub-0.18 μm salicided CMOS device
CHARTERED SEMICONDUCTOR MFG55 citations95
US6762085B2Jul 13, 2004
Method of forming a high performance and low cost CMOS device
CHARTERED SEMICONDUCTOR MFG36 citations92
US6734082B2May 11, 2004
Method of forming a shallow trench isolation structure featuring a group of insulator liner layers located on the surfaces of a shallow trench shape
CHARTERED SEMICONDUCTOR MFG45 citations92
US6297126B1Oct 2, 2001
Silicon nitride capped shallow trench isolation method for fabricating sub-micron devices with borderless contacts
CHARTERED SEMICONDUCTOR MFG20 citations92
US6271133B1Aug 7, 2001
Optimized Co/Ti-salicide scheme for shallow junction deep sub-micron device fabrication
CHARTERED SEMICONDUCTOR MFG36 citations92
US6093628AJul 25, 2000
Ultra-low sheet resistance metal/poly-si gate for deep sub-micron CMOS application
CHARTERED SEMICONDUCTOR MFG41 citations90
US6586314B1Jul 1, 2003
Method of forming shallow trench isolation regions with improved corner rounding
CHARTERED SEMICONDUCTOR MFG7 citations74