Inventor
HU WEN-HUNG
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HU WEN-HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PREC TECHNOLOGY CORP
8 patentsUS7705456B2Apr 27, 2010
Semiconductor package substrate
PHOENIX PREC TECHNOLOGY CORP38 citations92
US7608929B2Oct 27, 2009
Electrical connector structure of circuit board and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP8 citations83
US7705471B2Apr 27, 2010
Conductive bump structure of circuit board and method for forming the same
PHOENIX PREC TECHNOLOGY CORP7 citations73
US7674362B2Mar 9, 2010
Method for fabrication of a conductive bump structure of a circuit board
PHOENIX PREC TECHNOLOGY CORP7 citations73
US7350298B2Apr 1, 2008
Method for fabricating circuit board with conductive structure
PHOENIX PREC TECHNOLOGY CORP7 citations72
US7151050B2Dec 19, 2006
Method for fabricating electrical connection structure of circuit board
PHOENIX PREC TECHNOLOGY CORP7 citations72
US7659193B2Feb 9, 2010
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof
PHOENIX PREC TECHNOLOGY CORP3 citations62
US7341934B2Mar 11, 2008
Method for fabricating conductive bump of circuit board
PHOENIX PREC TECHNOLOGY CORP5 citations59
HU WEN-HUNG
3 patentsUS8058564B2Nov 15, 2011
Circuit board surface structure
HU WEN-HUNG4 citations60
US8188377B2May 29, 2012
Circuit board having electrically connecting structure and fabrication method thereof
HU WEN-HUNG2 citations55
US8269354B2Sep 18, 2012
Semiconductor package substrate structure and manufacturing method thereof
HU WEN-HUNG0 citations49