Inventor
KOOK TAEHO
US26 patents
⚠️ This page may combine multiple inventors who share the name “KOOK TAEHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AGERE SYSTEMS INC
9 patentsUS7115985B2Oct 3, 2006
Reinforced bond pad for a semiconductor device
AGERE SYSTEMS INC65 citations94
US7429502B2Sep 30, 2008
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
AGERE SYSTEMS INC23 citations91
US7301231B2Nov 27, 2007
Reinforced bond pad for a semiconductor device
AGERE SYSTEMS INC31 citations89
US7777333B2Aug 17, 2010
Structure and method for fabricating flip chip devices
AGERE SYSTEMS INC9 citations82
US7397103B2Jul 8, 2008
Semiconductor with damage detection circuitry
AGERE SYSTEMS INC11 citations81
US7327029B2Feb 5, 2008
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink
AGERE SYSTEMS INC3 citations61
US7221173B2May 22, 2007
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
AGERE SYSTEMS INC6 citations61
US8030199B2Oct 4, 2011
Transistor fabrication method
AGERE SYSTEMS INC0 citations52
US7973544B2Jul 5, 2011
Thermal monitoring and management of integrated circuits
AGERE SYSTEMS INC0 citations50
LUCENT TECHNOLOGIES INC
5 patentsUS5573965ANov 12, 1996
Method of fabricating semiconductor devices and integrated circuits using sidewall spacer technology
LUCENT TECHNOLOGIES INC114 citations97
US6008123ADec 28, 1999
Method for using a hardmask to form an opening in a semiconductor substrate
LUCENT TECHNOLOGIES INC77 citations95
US5891784AApr 6, 1999
Transistor fabrication method
LUCENT TECHNOLOGIES INC70 citations94
US5589303ADec 31, 1996
Self-aligned opaque regions for attenuating phase-shifting masks
LUCENT TECHNOLOGIES INC17 citations72
US5945355AAug 31, 1999
Integrated circuit fabrication
LUCENT TECHNOLOGIES INC1 citations51
TRIQUINT SEMICONDUCTOR INC
3 patentsUS7939987B1May 10, 2011
Acoustic wave device employing reflective elements for confining elastic energy
TRIQUINT SEMICONDUCTOR INC133 citations97
US8035464B1Oct 11, 2011
Bonded wafer SAW filters and methods
TRIQUINT SEMICONDUCTOR INC46 citations93
US8044553B2Oct 25, 2011
Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor
TRIQUINT SEMICONDUCTOR INC2 citations58