Inventor

HU JUNG-CHIH

TW8 patents

⚠️ This page may combine multiple inventors who share the name “HU JUNG-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

2 patents

US6171717B1Jan 9, 2001

Structure of stacked barrier layer

UNITED MICROELECTRONICS CORP17 citations83

US6417118B1Jul 9, 2002

Method for improving the moisture absorption of porous low dielectric film

UNITED MICROELECTRONICS CORP16 citations82

WU WENG-JIN

2 patents

US8664749B2Mar 4, 2014

Component stacking using pre-formed adhesive films

WU WENG-JIN2 citations62

US8058150B2Nov 15, 2011

Particle free wafer separation

WU WENG-JIN6 citations62

YANG KU-FENG

1 patent

US8691664B2Apr 8, 2014

Backside process for a substrate

YANG KU-FENG14 citations83

CHIOU WEN-CHIH

1 patent

US8486823B2Jul 16, 2013

Methods of forming through via

CHIOU WEN-CHIH10 citations83

MERCK PATENT GMBH

1 patent

US6858123B1Feb 22, 2005

Galvanizing solution for the galvanic deposition of copper

MERCK PATENT GMBH10 citations66

TAIWAN SEMICONDUCTOR MFG

1 patent

US7943421B2May 17, 2011

Component stacking using pre-formed adhesive films

TAIWAN SEMICONDUCTOR MFG3 citations62