Inventor · disambiguated record
Hongpo Hu
Also filed as: HU HONGPO
7 granted patents·2 pending applications·3 citations·filing 2010–2025
72Inventor score
Top patents by PatentIndex Score
9 records- 0168US8859315B2Epitaxial wafer and manufacturing method thereofBYD CO LTD·Filed 2012·Granted Oct 14, 2014·1 cites·5 claims
- 0262US2025226209A1Substrate stripping method and epitaxial waferHC SEMITEK ZHEJIANG CO LTD·Filed 2025·Application pending·0 cites
- 0361US8324634B2Epitaxial wafer and manufacturing method thereofSU XILIN·Filed 2010·Granted Dec 4, 2012·1 cites·9 claims
- 0457US12261040B2Substrate stripping method and epitaxial waferHC SEMITEK ZHEJIANG CO LTD·Filed 2020·Granted Mar 25, 2025·0 cites·20 claims
- 0556US9093596B2Epitaxial wafer for light emitting diode, light emitting diode chip and methods for manufacturing the sameHUO DONGMING·Filed 2012·Granted Jul 28, 2015·1 cites·11 claims
- 0641US8723188B2Light emitting diode and method for preparing the sameXIE CHUNLIN·Filed 2012·Granted May 13, 2014·0 cites·10 claims
- 0737US8932892B2Epitaxiay wafer, method for manufacturing the same and method for manufacturing LED chipZHANG WANG·Filed 2012·Granted Jan 13, 2015·0 cites·18 claims
- 0835US2012261702A1Led, led chip and method of forming the sameSU XILIN·Filed 2012·Application pending·0 cites
- 0932US8928006B2Substrate structure, method of forming the substrate structure and chip comprising the substrate structureXIE CHUNLIN·Filed 2012·Granted Jan 6, 2015·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →