Inventor
LEE MENG-TSUNG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “LEE MENG-TSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
9 patentsUS9875981B2Jan 23, 2018
Semiconductor device having conductive vias
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US10049955B2Aug 14, 2018
Fabrication method of wafer level packaging semiconductor package with sandwich structure of support plate isolation layer and bonding layer
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9812340B2Nov 7, 2017
Method of fabricating semiconductor package having semiconductor element
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US9502333B2Nov 22, 2016
Semiconductor device having conductive vias
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations62
US10199331B2Feb 5, 2019
Fabrication method of electronic package having embedded package block
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations61
US9324585B2Apr 26, 2016
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US9041189B2May 26, 2015
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9899237B2Feb 20, 2018
Carrier, semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US10192838B2Jan 29, 2019
Fabrication method of packaging substrate
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations46