Inventor
LAI YI-CHE
TW23 patents
Patents
23 patentsUS10062651B2Aug 28, 2018
Packaging substrate and electronic package having the same
SILICONWARE PRECISION INDUSTRIES CO LTD48 citations93
US9324582B2Apr 26, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD9 citations83
US9899308B2Feb 20, 2018
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations72
US9875981B2Jan 23, 2018
Semiconductor device having conductive vias
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US9607939B2Mar 28, 2017
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US9520304B2Dec 13, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations72
US10199341B2Feb 5, 2019
Substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US10049975B2Aug 14, 2018
Substrate structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9502333B2Nov 22, 2016
Semiconductor device having conductive vias
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations62
US8952528B2Feb 10, 2015
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US8952537B2Feb 10, 2015
Conductive bump structure with a plurality of metal layers
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations60
US9666536B2May 30, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US9627226B2Apr 18, 2017
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9349705B2May 24, 2016
Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9269693B2Feb 23, 2016
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations50
US9548220B2Jan 17, 2017
Method of fabricating semiconductor package having an interposer structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9418874B2Aug 16, 2016
Method of fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9257381B2Feb 9, 2016
Semiconductor package, and interposer structure of the semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9087780B2Jul 21, 2015
Semiconductor package and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US8987012B2Mar 24, 2015
Method of testing a semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US9720013B2Aug 1, 2017
Method of fabricating a semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations46
US9607974B2Mar 28, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US9754898B2Sep 5, 2017
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40