Inventor
YOKOKAWA ISAO
JP32 patents
⚠️ This page may combine multiple inventors who share the name “YOKOKAWA ISAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU HANDOTAI KK
27 patentsUS7052974B2May 30, 2006
Bonded wafer and method of producing bonded wafer
SHINETSU HANDOTAI KK47 citations96
US6312797B1Nov 6, 2001
Method for manufacturing bonded wafer and bonded wafer
SHINETSU HANDOTAI KK74 citations96
US6284629B1Sep 4, 2001
Method of fabricating an SOI wafer and SOI wafer fabricated by the method
SHINETSU HANDOTAI KK78 citations96
US6245645B1Jun 12, 2001
Method of fabricating an SOI wafer
SHINETSU HANDOTAI KK80 citations96
US7315064B2Jan 1, 2008
Bonded wafer and method of producing bonded wafer
SHINETSU HANDOTAI KK20 citations92
US7084046B2Aug 1, 2006
Method of fabricating SOI wafer
SHINETSU HANDOTAI KK46 citations92
US6900113B2May 31, 2005
Method for producing bonded wafer and bonded wafer
SHINETSU HANDOTAI KK21 citations92
US6566233B2May 20, 2003
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK44 citations92
US6306730B2Oct 23, 2001
Method of fabricating an SOI wafer and SOI wafer fabricated by the method
SHINETSU HANDOTAI KK29 citations92
US7550309B2Jun 23, 2009
Method for producing semiconductor wafer
SHINETSU HANDOTAI KK10 citations84
US6959854B2Nov 1, 2005
Production method for bonded substrates
SHINETSU HANDOTAI KK17 citations84
US7091107B2Aug 15, 2006
Method for producing SOI wafer and SOI wafer
SHINETSU HANDOTAI KK8 citations74
US8361888B2Jan 29, 2013
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK2 citations63
US7521265B2Apr 21, 2009
Method for measuring an amount of strain of a bonded strained wafer
SHINETSU HANDOTAI KK5 citations63
US8053334B2Nov 8, 2011
Method for forming silicon oxide film of SOI wafer
SHINETSU HANDOTAI KK3 citations61
US10886163B2Jan 5, 2021
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations52
US9673086B2Jun 6, 2017
Method of producing bonded wafer
SHINETSU HANDOTAI KK1 citations52
US9076840B2Jul 7, 2015
Method for manufacturing a bonded SOI wafer
SHINETSU HANDOTAI KK1 citations52
US7985660B2Jul 26, 2011
Method for manufacturing soi wafer
SHINETSU HANDOTAI KK0 citations52
US7959731B2Jun 14, 2011
Method for producing semiconductor wafer
SHINETSU HANDOTAI KK0 citations52
US7608548B2Oct 27, 2009
Method for cleaning a multilayer substrate and method for bonding substrates and method for producing a bonded wafer
SHINETSU HANDOTAI KK1 citations52
US7524744B2Apr 28, 2009
Method of producing SOI wafer and SOI wafer
SHINETSU HANDOTAI KK1 citations52
US9337080B2May 10, 2016
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK1 citations51
US10763157B2Sep 1, 2020
Method for manufacturing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US10347525B2Jul 9, 2019
Method for producing bonded SOI wafer
SHINETSU HANDOTAI KK0 citations42
US10204824B2Feb 12, 2019
Method for producing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US9865497B2Jan 9, 2018
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations42
YOKOKAWA ISAO
3 patentsUS8956951B2Feb 17, 2015
Method for manufacturing SOI wafer
YOKOKAWA ISAO6 citations71
US8906708B2Dec 9, 2014
Method for checking ion implantation condition and method for manufacturing semiconductor wafer
YOKOKAWA ISAO2 citations60
US8962352B2Feb 24, 2015
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer
YOKOKAWA ISAO0 citations39