Inventor
KANEDA WATARU
JP9 patents
Patents
9 patentsUS9455219B2Sep 27, 2016
Wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO8 citations83
US9000302B2Apr 7, 2015
Wiring board
SHINKO ELECTRIC IND CO8 citations83
US9780043B2Oct 3, 2017
Wiring board, semiconductor package, and semiconductor device
SHINKO ELECTRIC IND CO3 citations72
US9565775B2Feb 7, 2017
Wiring board, semiconductor device, and method of manufacturing wiring board
SHINKO ELECTRIC IND CO2 citations71
US9119319B2Aug 25, 2015
Wiring board, semiconductor device, and method for manufacturing wiring board
SHINKO ELECTRIC IND CO6 citations70
US11430725B2Aug 30, 2022
Wiring board and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations62
US10978383B2Apr 13, 2021
Wiring board and method of manufacturing the same
SHINKO ELECTRIC IND CO1 citations62
US9148952B2Sep 29, 2015
Wiring board
SHINKO ELECTRIC IND CO0 citations51
US9380707B2Jun 28, 2016
Method of manufacturing wiring substrate
SHINKO ELECTRIC IND CO0 citations41